Intel Celeron G3900 Processor
Computer Hardware / Electronics

Intel Celeron G3900 Processor

This item is a central processing unit (CPU) for a desktop computer, specifically an Intel Celeron G3900. It features a square Land Grid Array (LGA) design with a dark green fiber-reinforced substrate base and a silver-colored integrated heat spreader (IHS) made of nickel-plated copper. The IHS is laser-etched with technical specifications: 'INTEL CELERON', model number 'G3900', S-spec code 'SR2HV', a base clock frequency of '2.80GHZ', and a serial/batch number 'X713D213'. Launched in early 2016 as part of the Skylake sixth-generation microarchitecture, this dual-core processor is designed for the LGA 1151 socket. Physically, the chip measures approximately 37.5mm x 37.5mm. The condition appears fair to good for a used component; the surface of the IHS shows minor mechanical wear and remnants of thermal paste in the crevices near the mounting wings. There are no visible chips to the green substrate or deep scratches on the metal surface that would impede thermal transfer. This is a low-end, budget-oriented component intended for basic productivity tasks, representing the entry-level tier of Intel's silicon manufacturing from the mid-2010s.

Estimated Value

$5.00 - $12.00

Basic Information

Category

Computer Hardware / Electronics

Appraised On

December 23, 2025

Estimated Value

$5.00 - $12.00

Item Description

This item is a central processing unit (CPU) for a desktop computer, specifically an Intel Celeron G3900. It features a square Land Grid Array (LGA) design with a dark green fiber-reinforced substrate base and a silver-colored integrated heat spreader (IHS) made of nickel-plated copper. The IHS is laser-etched with technical specifications: 'INTEL CELERON', model number 'G3900', S-spec code 'SR2HV', a base clock frequency of '2.80GHZ', and a serial/batch number 'X713D213'. Launched in early 2016 as part of the Skylake sixth-generation microarchitecture, this dual-core processor is designed for the LGA 1151 socket. Physically, the chip measures approximately 37.5mm x 37.5mm. The condition appears fair to good for a used component; the surface of the IHS shows minor mechanical wear and remnants of thermal paste in the crevices near the mounting wings. There are no visible chips to the green substrate or deep scratches on the metal surface that would impede thermal transfer. This is a low-end, budget-oriented component intended for basic productivity tasks, representing the entry-level tier of Intel's silicon manufacturing from the mid-2010s.

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