
Intel Celeron G3900 Processor
This item is a central processing unit (CPU) for a desktop computer, specifically an Intel Celeron G3900. It features a square Land Grid Array (LGA) design with a dark green fiber-reinforced substrate base and a silver-colored integrated heat spreader (IHS) made of nickel-plated copper. The IHS is laser-etched with technical specifications: 'INTEL CELERON', model number 'G3900', S-spec code 'SR2HV', a base clock frequency of '2.80GHZ', and a serial/batch number 'X713D213'. Launched in early 2016 as part of the Skylake sixth-generation microarchitecture, this dual-core processor is designed for the LGA 1151 socket. Physically, the chip measures approximately 37.5mm x 37.5mm. The condition appears fair to good for a used component; the surface of the IHS shows minor mechanical wear and remnants of thermal paste in the crevices near the mounting wings. There are no visible chips to the green substrate or deep scratches on the metal surface that would impede thermal transfer. This is a low-end, budget-oriented component intended for basic productivity tasks, representing the entry-level tier of Intel's silicon manufacturing from the mid-2010s.
AI-Generated Appraisal Disclaimer
Estimated Value
$5.00 - $12.00
Basic Information
Category
Computer Hardware / Electronics
Appraised On
December 23, 2025
Estimated Value
$5.00 - $12.00
Item Description
This item is a central processing unit (CPU) for a desktop computer, specifically an Intel Celeron G3900. It features a square Land Grid Array (LGA) design with a dark green fiber-reinforced substrate base and a silver-colored integrated heat spreader (IHS) made of nickel-plated copper. The IHS is laser-etched with technical specifications: 'INTEL CELERON', model number 'G3900', S-spec code 'SR2HV', a base clock frequency of '2.80GHZ', and a serial/batch number 'X713D213'. Launched in early 2016 as part of the Skylake sixth-generation microarchitecture, this dual-core processor is designed for the LGA 1151 socket. Physically, the chip measures approximately 37.5mm x 37.5mm. The condition appears fair to good for a used component; the surface of the IHS shows minor mechanical wear and remnants of thermal paste in the crevices near the mounting wings. There are no visible chips to the green substrate or deep scratches on the metal surface that would impede thermal transfer. This is a low-end, budget-oriented component intended for basic productivity tasks, representing the entry-level tier of Intel's silicon manufacturing from the mid-2010s.
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